Senior Engineer, E-Modules

Job Type:
Job Sector:
Electronics, Engineering
London, Europe
Salary Description:
Plus benefits
Job Ref:

Senior Engineer, E-Modules | Competitive salary + bonus and benefits | Semiconductor Design Sector | Switzerland

SRGEurope has been appointed to recruit a Senior Engineer by our client, a leader in the RFIC Design sector in Europe, to work in their E-Modules Business Unit. The successful Senior Engineer will bring with them a wealth of knowledge in the packaging and assembly of ICs and PCBs in the Semiconductor sector.

Senior Engineer, E-Modules Responsibilities:

A Senior Engineer with a wide knowledge of process in IC (bumping, moulding, wire bonding) and PCB (encapsulation, soldering, bonding) assembly, you will:

* Take responsibility for the pre-assembly and assembly process availability, as well as drive continuous improvement of pre-existing processes in order to increase capability, yield, and quality
* Actively support the development of pre-assembly and assembly processes as well as development of electronic module products and processes
* Scout and then drive ahead the requisite technological innovations to reach both cost and industrialization targets
* Be in charge of technical management of all outsourced processes, again to ensure quality and availability
* Lead ad-hoc, cross-functional problem-solving teams for technical and quality-related process problems stemming from the back end
* Apply methodic competencies, such as Sixsigma, Doe, and SPC, to process development and process control

The Requirements:

* MSc or PhD in electrical engineering, physics, material science or equivalent

* A minimum of 5 years’ professional experience in the packaging and assembly of IC/PCB in the semicon sector
* A wide knowledge of process in IC (bumping, moulding, wire bonding) and PCB (encapsulation, soldering, bonding) assembly
* Experience with characterisation methods and qualification methods for these processes
* Willing to travel, as this will make up up to 20% of your time
* Fluency in English and French (both spoken and written); German a bonus

The Company

Currently leading the way in designing some of the most advanced RFID tech in the market, including some of the smallest Bluetooth chips available, the client is a global leader in Wearables, Automotive, Healthcare, Industrial, and more. Comprised of small business units, you will be capable not only in your specialism but have a broad working knowledge across a number of others, also.

To Apply

If you would like to proceed to the next stage press apply now, if you want to know more e-mail us at or call us on 0207 183 6462 we look forward to hearing from you.

We have a variety of jobs ranging from �25k-�150k, so if this one is not suitable please visit our website for other exciting opportunities you can apply for.

KEYWORDS: RFID | SPC | Statistical Process Control | DOE | Design of Experiments | Sixsigma | IC | PCB | IC Packaging | IC Assembly

Contact Details:
Tel: 00350 200 69999
Contact: Tom Thronicker

You may return to your current search results by clicking here.


This website uses cookies. Read our cookie policy for more information. By continuing to browse this site you are agreeing to our use of cookies.

Latest Job Listings